We Are: At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content. Join us to transform the future through continuous technological innovation.

You Are: A dynamic, forward-thinking individual with a deep understanding of electronic and microelectronic engineering. With a minimum of 12 years of hands-on experience in RTL2GDS and 3DIC segments, you're no stranger to advanced 2.5D and 3D technology development.  You're well-versed in semiconductor manufacturing processes and packaging technologies, and your ability to deliver technical presentations, conduct product demonstrations, and develop solutions is unparalleled. You are driven by the thrill of leading technical 3DIC enablement, deployment, and customer adoption initiatives and you're ready to bring your unique skill set to a high-performing team.

What You’ll Be Doing:

  • Leading pathfinding activities to enable leading-edge process technology and foundry enablement.
  • Driving 2.5D and 3D technology development, including APR, EM/IR, Thermal, and SI/PI enablement.
  • Utilizing deep Synopsys tools and flows knowledge to streamline and optimize processes.
  • Leveraging scripting languages such as tcl, python, Perl, and unix shell for various tasks and projects.
  • Applying sound knowledge of semiconductor manufacturing processes and packaging technologies.
  • Delivering technical presentations, conducting product demonstrations, and participating in developing solutions and deployment strategies.

The Impact You Will Have:

  • You will be instrumental in advancing our technology and process development.
  • Your contributions will help shape the future of semiconductor manufacturing.
  • Your work will enable us to continue delivering high-performance silicon chips and software content.
  • You will play a pivotal role in enabling our customers to adopt our technology.
  • Your insights and expertise will help us continuously innovate and improve.
  • Your leadership will foster a culture of excellence within our team.

What You’ll Need:

  • A minimum of a Bachelor's Degree in Electronic / Microelectronics.
  • A minimum of 12 years of hands-on experience in RTL2GDS and hands on knowledge in  3DIC segments.
  • Advanced knowledge of 2.5D and 3D technology development, including APR, EM/IR, Thermal, and SI/PI.
  • Proficiency in scripting languages such as tcl, python, Perl, and unix shell.
  • Deep understanding of semiconductor manufacturing processes and packaging technologies.

Who You Are: A proactive, results-driven individual with excellent communication skills. You're a team player who thrives in collaborative environments, and you're always seeking innovative solutions to complex problems.

The Team You’ll Be A Part Of: You'll be joining our trailblazing 3DIC Research and Development team, a group of innovators and thought leaders at the forefront of 3DIC applications in the semiconductor and foundry ecosystem. Our team is constantly pushing the boundaries of technology and is passionate about transforming ideas into realities. We thrive on collaboration and the exchange of ideas, and we are committed to supporting each other in our quest for innovation. Join us, and be a part of a team that's shaping the future of technology.

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The base salary range across the U.S. for this role is between $155,000-$233,000. In addition, this role may be eligible for an annual bonus, equity, and other discretionary bonuses. Synopsys offers comprehensive health, wellness, and financial benefits as part of a competitive total rewards package. The actual compensation offered will be based on a number of job-related factors, including location, skills, experience, and education. Your recruiter can share more specific details on the total rewards package upon request.

Inclusion and Diversity: Synopsys considers all applicants for employment without regard to race, color, religion, sex, gender preference, national origin, age, disability, or status as a Covered Veteran in accordance with federal law.


 

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